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Heat Sink Compound

25g Tube Heat Sink Compound
Specifications:
Material Silicone Based
   
Temperature Range –50°C to +180°C
Thermal Conductivity  >3.2Watt/m-k
Thermal Impedance <0.06 degree C-in2/Watt
Size 25g
Heat sink compound white -50°C ~ 180°C for Transistors, Diodes, CPU's etc. 25gram compound tube type
Order Code   Each  
253-100 25g Tube Heatsink Compound 2.68  

 

Syringe of Heat Sink Compound
Specifications:
Material Silicone Based
   
Temperature Range –50°C to +180°C
Thermal Conductivity  >3.2Watt/m-k
Thermal Impedance <0.06 degree C-in2/Watt
Size 25g
Heat sink compound for use on PCBs for Transistors, Diodes, CPU's etc. Can be used between -50°C ~ 180°C
25 g compound injection type.
Order Code   Each  
253-115 25g Syringe of Heatsink Compound 3.70  

 

CPU Cooling Paste
Specifications:
Material  
   
Temperature Range –10°C to +150°C
Thermal impedance  <0,120 ℃-in2/W
Size 4g
This cooling paste is to be applied in a small quantity on the CPU before the cooler is being placed. Due to the special compound of the paste the heat is much better guided away from the CPU to the cooler. This grease-like compound will not dry out, harden, or melt. This paste is designed to provide optimal heat transfer from the CPU to the cooler.
Order Code   Each  
253-120 CPU Cooling Paste Silver (4g) 8.14  

 

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sales@esr.co.uk

Tel: 0191 251 4363

  
 

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All Prices are in Pounds Sterling and Exclude VAT