Heat Sink Compound

Specifications:
Material	Silicone Based

Temperature Range	–50°C to +180°C
Thermal Conductivity	>3.2Watt/m-k
Thermal Impedance	<0.06 degree C-in2/Watt
Size	5g

Heat sink compound white -50°C ~ 180°C for Transistors, Diodes, CPU's etc. 5gram compound tube type

Order Code		Each
253-090	5g Tube Heatsink Compound	1.32

Specifications:
Material	Silicone Based

Temperature Range	–50°C to +180°C
Thermal Conductivity	>3.2Watt/m-k
Thermal Impedance	<0.06 degree C-in2/Watt
Size	25g

Heat sink compound for use on PCBs for Transistors, Diodes, CPU's etc. Can be used between -50°C ~ 180°C
25 g compound injection type.

Order Code		Each
253-105	25g Syringe of Heatsink Compound	3.71

Specifications:
Material

Temperature Range	–10°C to +150°C
Thermal impedance	8.5W/m-k
Size	4g

This cooling paste is to be applied in a small quantity on the CPU before the cooler is being placed. Due to the special compound of the paste the heat is much better guided away from the CPU to the cooler. This grease-like compound will not dry out, harden, or melt. This paste is designed to provide optimal heat transfer from the CPU to the cooler.

Order Code		Each
253-120	CPU Cooling Paste Silver (4g)	4.50

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Tel: 0191 251 4363

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