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Heat Sink Compound

25g Tube Heat Sink Compound
Specifications:
MaterialSilicone Based
  
Temperature Range50C to +180C
Thermal Conductivity >3.2Watt/m-k
Thermal Impedance<0.06 degree C-in2/Watt
Size25g
Heat sink compound white -50C ~ 180C for Transistors, Diodes, CPU's etc. 25gram compound tube type
Order Code 13+5+ 
253-10025g Tube Heatsink Compound2.452.211.96 

 

Syringe of Heat Sink Compound
Specifications:
MaterialSilicone Based
  
Temperature Range50C to +180C
Thermal Conductivity >3.2Watt/m-k
Thermal Impedance<0.06 degree C-in2/Watt
Size25g
Heat sink compound for use on PCBs for Transistors, Diodes, CPU's etc. Can be used between -50C ~ 180C
25 g compound injection type.
Order Code 13+5+ 
253-11525g Syringe of Heatsink Compound2.222.001.81 

 

KONIG Cooling Paste Silver
Specifications:
MaterialSilicone Based
  
Temperature Range10C to +150C
Thermal impedance <0,120 ℃-in2/W
Size3g
Applied to the CPU before fitting the heat sink, this silver heat sink compound improves thermal conductivity. The compound does not harden, dry out or melt even after long term exposure to temperatures up to 150deg C
Order Code 13+5+ 
253-120KONIG CPU Cooling Paste Silver (3g)3.663.922.93 

 

 

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Tel: 0191 251 4363

Fax: 0191 252 2296

 
 

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